Two 59%+ winners, four above 25% in Aug – How this AI model keeps picking winners
TAIPEI - Hon Hai Precision Industry Co., Ltd., also known as Foxconn, announced it will issue its third round of unsecured corporate bonds for 2025, totaling NTD 11.4 billion (approximately USD 380 million) across four tranches with varying maturities.
According to a press release statement, the bonds will be issued on August 18, 2025, with tenors ranging from 3 to 10 years. The offering includes a 3-year tranche of NTD 3.5 billion with a 1.85% fixed annual interest rate, a 5-year tranche of NTD 6 billion at 1.88%, a 7-year tranche of NTD 100 million at 1.93%, and a 10-year tranche of NTD 1.8 billion at 1.99%.
All bonds will be issued at par value of NTD 1 million per unit and will pay interest annually based on simple interest calculations. The principal for each tranche will be repaid in full upon maturity.
The largest portion of the issuance is allocated to the 5-year bonds, representing approximately 52.6% of the total offering. The 3-year and 10-year bonds make up most of the remainder, while the 7-year tranche is comparatively small at just NTD 100 million.
The bonds will trade under the codes B644DM, B644DN, B644DP, and B644DQ for the respective tranches.
Hon Hai Precision Industry is one of the world’s largest electronics manufacturing service providers and a major supplier for companies like Apple. The company has not specified the intended use of the proceeds from this bond issuance.
This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.