Manz Asia and Smartkem showcase chip packaging tech

Published 19/05/2025, 12:22
Manz Asia and Smartkem showcase chip packaging tech

SINGAPORE - A collaboration between Smartkem (SMTK), a micro-cap semiconductor technology company currently valued at $3.91 million, and Manz Asia, a manufacturer of semiconductor equipment, will be on display at SEMICON® SEA 2025 in Singapore from May 20 to May 22. The partnership focuses on demonstrating a new inkjet printable dielectric technology for advanced computer and AI chip packaging. According to InvestingPro data, while Smartkem maintains a healthy balance sheet with more cash than debt, the company faces significant challenges with rapid cash burn.

Smartkem and Manz Asia are presenting their joint solution, which leverages Manz Asia’s inkjet printing equipment and Smartkem’s dielectric materials. This technology aims to address the increasing demand for AI, which requires more complex chip packaging. The companies claim that their approach can potentially enable more efficient panel level chip packaging, which is projected to be a $600 million market by 2030, growing at a 27% compound annual growth rate from 2024. Despite this promising market outlook, InvestingPro analysis shows Smartkem’s stock has declined over 90% in the past year, with analysts anticipating sales challenges in the current year. Subscribers to InvestingPro can access 15 additional key insights about Smartkem’s financial health and market position.

The inkjet metallization process developed by Manz Asia allows for the precise deposition of materials on various substrates, including silicon and glass, in both wafer and panel formats. This maskless technology is touted as a green manufacturing solution that could scale up semiconductor advanced packaging. While Smartkem maintains a current ratio of 2.68, indicating strong short-term liquidity, the company’s financial health score of 1.68 suggests ongoing operational challenges.

Smartkem’s contribution comes from its UV curable dielectric layer chemistry, which has been adapted into ink formulations compatible with Manz Asia’s equipment. These inks are designed for use in advanced packaging applications and offer benefits such as higher throughput and lower cost per chip due to economies of scale.

The collaboration is part of Smartkem’s broader efforts to innovate in the electronics industry with its TRUFLEX® semiconductor polymers and other materials. The company operates an R&D facility in Manchester, UK, and is actively developing commercial-scale production processes.

Manz Asia, renowned for its technological innovation in the semiconductor sector, provides equipment solutions for various packaging applications, including Fan-Out Panel-Level Packaging (FOPLP) and Through Glass Via (TGV).

The SEMICON® SEA event serves as a platform for semiconductor organizations to showcase sustainable practices and innovations in the industry. The collaboration between Smartkem and Manz Asia is a notable example of how companies are responding to the need for more resilient and environmentally friendly manufacturing processes. This information is based on a press release statement.

In other recent news, SmartKem, Inc. has announced several key developments. The company reported an automatic conversion of its Series A-1 Convertible Preferred Stock into common shares and warrants, resulting in the issuance of 690,788 common shares and Class C warrants to purchase an additional 1,282,412 common shares. This conversion aligns with SmartKem’s corporate strategy and reflects changes in its capital structure. Additionally, SmartKem has appointed Jonathan Watkins as the new Chief Operating Officer. Watkins brings over three decades of industry experience and will focus on global operations and strategic partnerships.

In another update, SmartKem’s Compensation Committee approved cash bonuses for its executive team. CEO Ian Jenks will receive a $150,000 bonus, while CFO Barbra Keck is set to receive $99,041. Both CTO Simon Ogier, Ph.D., and Chief Scientist Beverley Brown, Ph.D., will receive bonuses of $31,480 each. These bonuses acknowledge the contributions of the executive team as the company continues to navigate the competitive semiconductor industry. These developments are part of SmartKem’s ongoing efforts to strengthen its market position and operational capabilities.

This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

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