Teledyne selects onsemi’s Treo platform for infrared imaging systems

SCOTTSDALE, Ariz. - Teledyne Technologies has chosen onsemi’s Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits for infrared imaging systems, according to a press release issued Tuesday. onsemi (NASDAQ: ON), a prominent player in the semiconductor industry with a market capitalization of $21.55 billion, currently appears undervalued according to InvestingPro analysis.

The 65nm Treo platform will be used to create infrared focal plane array systems for aerospace, defense, security, and scientific applications. The technology combines onsemi’s ROIC offering with precision analog, advanced digital, and low-voltage power features. With a strong current ratio of 5.02, InvestingPro data shows onsemi maintains robust operational flexibility, with liquid assets well exceeding short-term obligations.

The platform’s architecture provides higher gate density in a smaller footprint, lower power dissipation, dense on-chip energy storage, and low resistivity substrates for radiation resilience. It also supports wide temperature ranges and die stitching for large-format sensor designs.

"The ability to deliver high-performance imaging sensors that operate reliably in the harshest environments is critical for our space products," said Anders Petersen, Teledyne Imaging Sensors Chief Engineer and Fellow. "The onsemi Treo platform provides the advanced capabilities we need to add more functionality in a smaller footprint."

Michel De Mey, Vice President of onsemi’s Sensor Interface Division, noted that the platform’s modular architecture and IP building blocks help accelerate innovation while reducing time to market.

The Treo platform is manufactured at onsemi’s East Fishkill, NY facility, which holds Category 1A Trusted Supplier accreditation, positioning it to address U.S. government needs for domestic chip manufacturing supporting national security.

onsemi (NASDAQ:ON) focuses on automotive and industrial end-markets, with emphasis on vehicle electrification, sustainable energy grids, industrial automation, and 5G infrastructure. While trading at a relatively high P/E ratio of 48.5, the company is preparing to report its next earnings on November 3rd. InvestingPro subscribers have access to 13 additional exclusive insights and comprehensive analysis through the Pro Research Report, helping investors make informed decisions ahead of important market events.

In other recent news, onsemi has completed its acquisition of Vcore power technologies from Aura Semiconductor. This acquisition is intended to bolster onsemi’s power management capabilities, especially for data center applications involving artificial intelligence infrastructure. Meanwhile, PHP Ventures Acquisition Corp. has extended its merger deadline by depositing $4,770.70 into its trust account, allowing more time to find a suitable target for a potential merger or acquisition. The company remains classified as an emerging growth company.

BofA Securities has raised its price target for ON Semiconductor to $62.00, citing shortages at Nexperia that are affecting automotive supply chains. OneConnect Financial Technology announced it will halt trading of its American depositary shares on the NYSE on October 30 due to a privatization plan. This plan involves OneConnect becoming a wholly owned subsidiary of Ping An Insurance Group of China.

Additionally, Ascendis Pharma has granted 31,710 warrants to certain employees, with each warrant allowing the purchase of one ordinary share at $208.71 per share. The vesting schedule for these warrants spans over four years, with specific provisions for earlier vesting under certain conditions. These recent developments highlight significant activities across various companies, impacting their strategic and financial directions.

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