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SANTA CLARA - Taiwan Semiconductor Manufacturing Co. (TWSE: 2330, NYSE: TSM), the world’s leading semiconductor foundry with a market capitalization of ~$42 million and impressive revenue growth of nearly 11% over the last twelve months, announced its new A14 logic process technology at its North America Technology Symposium. This technology, expected to be produced in 2028, promises to enhance AI capabilities in devices and is a step up from its N2 process, which is set to start volume production later this year.
The A14 technology aims to deliver up to 15% speed improvement or up to 30% power reduction, along with more than a 20% increase in logic density compared to the N2 process. TSMC also introduced the evolution of its NanoFlex standard cell architecture to NanoFlex Pro, which is designed to provide greater performance and power efficiency. According to InvestingPro analysis, TSMC maintains strong financial health with a current ratio of 3.63, indicating robust operational efficiency. The platform reveals several more key insights about TSMC’s financial strength.
TSMC’s Chairman and CEO, Dr. C.C. Wei, stated that their cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds, driving customer innovation for an AI-driven future.
In addition to A14, TSMC showcased advancements in its high-performance computing (HPC) offerings, including its CoWoS technology, which will support integration of 12 or more HBM stacks in a package and is set for volume production in 2027. The company also highlighted the System-on-Wafer (SoW-X), a powerful computing solution expected to be produced in the same year.
For the smartphone market, TSMC introduced N4C RF technology to meet the demands of AI on edge devices, scheduled for risk production in the first quarter of 2026. With a P/E ratio of 87.51 and strong market positioning, TSMC continues to attract investor attention. Discover more detailed financial metrics and exclusive insights with InvestingPro, including comprehensive valuation analysis and growth projections. In the automotive sector, TSMC is finalizing the AEC-Q100 Grade-1 qualification for its advanced N3A process, addressing the needs of ADAS and AV systems. For IoT applications, the company’s N6e process is now in production, with the N4e process set to further enhance power efficiency for edge AI.
The symposium, held in Santa Clara, California, is a key event for TSMC, attracting over 2,500 attendees. It serves as a platform for the company to update customers on its latest technology developments and offers start-ups opportunities to showcase their products and connect with potential investors. With its next earnings report due on May 9, 2025, investors can access detailed financial analysis and Fair Value estimates through InvestingPro, which currently indicates the stock is trading below its Fair Value.
The symposium marks the beginning of a series of global Technology Symposiums by TSMC, which has been at the forefront of the semiconductor industry since its establishment in 1987. The company is known for its extensive range of advanced process technologies and design enablement solutions that support a global customer base. This news is based on a press release statement from TSMC.
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