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Investing.com -- BE Semiconductor Industries N.V. (AS:BESI)raised its long-term revenue forecast to as much as €1.9 billion during its 2025 Investor Day, citing increased demand for advanced chip packaging driven by AI and 3D assembly technologies.
The company, based in Duiven, the Netherlands, revised its target revenue range to between €1.5 billion and €1.9 billion, up from a previous projection of more than €1 billion.
Besi also raised its gross margin goal to 64% to 68%, from 62% to 66%, and increased its operating margin forecast to 40% to 55%, up from 35% to 50%.
Besi said the changes followed a strategic plan review completed in March with participation from key customers and stakeholders.
The review identified broader deployment of artificial intelligence technologies through 2030 across data centers, edge computing and consumer applications.
It also flagged faster adoption of 2.5D and 3D chiplet-based, wafer-level assembly designs.
These trends, according to the company, are expected to increase demand for Besi’s advanced packaging solutions for both logic and memory chips.
Sub-micron die attach systems and AI-related mainstream die attach systems were cited as major contributors to the revised forecasts.