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Investing.com -- On Monday, Nippon Electric Glass announced its plans to develop and ship samples of larger glass substrates for high-performance semiconductor devices by as early as 2026, according to Nikkei. The company aims to cater to the needs of chipmakers who require materials with superior heat resistance, a quality where their glass substrates excel over conventional plastic options.
The new product line will feature large square glass substrates approximately 510 millimeters in length, which is a significant increase from the currently available 300-mm products. Nippon Electric Glass is positioning its glass substrates to be more appealing for the production of AI chips, where managing heat and ensuring flatness are critical for performance.
The company has outlined a strategy to begin mass production of the 510-mm substrates once there is a confirmed demand from the semiconductor industry. Looking further ahead, Nippon Electric Glass also has plans to introduce even larger substrates, measuring 600 millimeters, into practical use by 2028.
This development represents a strategic move by Nippon Electric Glass to leverage its expertise in glass substrates and to potentially become a key supplier in the semiconductor industry, which is continually seeking materials that can improve chip performance. The larger substrates are expected to accommodate more chips, which could lead to more efficient production processes for chipmakers.
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