Synopsys and GlobalFoundries launch chip design program for universities

Published 04/09/2025, 18:06
Synopsys and GlobalFoundries launch chip design program for universities

SUNNYVALE/MALTA - Synopsys, Inc. (NASDAQ:SNPS) and GlobalFoundries (NASDAQ:GFS), an $18.4 billion market cap semiconductor manufacturer, announced Thursday a new educational program that will provide university students with hands-on chip design and manufacturing experience. InvestingPro data shows GlobalFoundries as a prominent player in the semiconductor industry, with strong liquidity metrics and a healthy balance sheet.

The initiative, launching this fall at 40 universities worldwide, aims to prepare engineering students with practical semiconductor design skills by giving them access to professional-grade electronic design automation tools and manufacturing capabilities. This strategic move comes as GlobalFoundries maintains a solid financial position, with a current ratio of 2.63 and more cash than debt on its balance sheet, according to InvestingPro analysis.

Under the program, Synopsys will provide its design software, training and support through the Synopsys Cloud design platform, while GlobalFoundries will manufacture student-designed chips through its GlobalShuttle Multi-Project Wafer Program.

"This collaboration will empower students with practical, hands-on experience using advanced tools and technologies," said Dr. Patrick Haspel, executive director of Synopsys Academic & Research Alliances.

The program focuses on integrating chip design into academic curricula, with professors receiving training to lead courses where students collaborate on designs. Completed student chips will be returned for testing in subsequent semesters.

Bika Carter, director of external R&D at GlobalFoundries, said the program aims to "enrich chip design education and help shape the future of our industry."

The initiative represents an expansion of existing academic outreach efforts by both companies. Synopsys currently operates its Academic & Research Alliances program providing software and training to universities, while GlobalFoundries’ University Partnership Program works with over 80 universities and 600 students on semiconductor research projects.

According to the press release statement, the collaboration seeks to address workforce development needs in the semiconductor industry by providing students with real-world design experience. While currently showing negative earnings, InvestingPro analysts project GlobalFoundries to return to profitability this year, positioning the company well for future growth. For detailed insights and additional ProTips about GlobalFoundries’ financial outlook, investors can access the comprehensive Pro Research Report available on InvestingPro.

In other recent news, GlobalFoundries has completed its acquisition of MIPS, a move aimed at enhancing its capabilities in artificial intelligence and edge computing. This acquisition is expected to strengthen GlobalFoundries’ portfolio in these high-growth markets. Additionally, GlobalFoundries has announced an expanded partnership with Apple to advance wireless connectivity and power management technologies. This collaboration will focus on enhancing U.S. chip manufacturing and is set to accelerate investments at GlobalFoundries’ facility in Malta, New York.

In personnel news, MIPS, now part of GlobalFoundries, has appointed Michael Zirngibl as Vice President of Business Development for the EMEA region. Zirngibl will lead efforts to expand business in automotive, industrial, and communications infrastructure markets. Meanwhile, Baird has lowered its price target for GlobalFoundries to $40, citing weaker demand and a projected revenue decline in the third quarter. Despite this, Baird maintains an Outperform rating on the company. These developments highlight the dynamic changes and strategic moves within GlobalFoundries as it navigates the semiconductor industry.

This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

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