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Investing.com -- Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) announced Tuesday it will phase out its 6-inch wafer manufacturing business over the next two years while continuing to consolidate its 8-inch wafer production capacity to improve efficiency.
The decision was made after a thorough evaluation based on market conditions and aligns with the company’s long-term business strategy.
TSMC stated it is working closely with customers to ensure a smooth transition and remains committed to meeting their needs during this period. The company emphasized that this move will not affect its previously announced financial targets.
Currently, TSMC operates only one 6-inch wafer fab and four 8-inch wafer fabs in Taiwan for mature-node chip manufacturing. The company’s advanced-node manufacturing for customers such as Apple (NASDAQ:AAPL) and Nvidia (NASDAQ:NVDA) is carried out in its 12-inch fabs.
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