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China Wafer Level CSP Co., Ltd. creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies. It offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. The company also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
Name | Age | Since | Title |
---|---|---|---|
Wei Wang | 57 | 2013 | Chairman of the Board, CEO, President & GM |
Ariel Poppel | 72 | 2013 | Supervisor |
Wen-Hao Liu | 54 | - | Director |
Wei Hong Ju | 55 | 2019 | Independent Director |
Yue Hong Qian | 61 | 2019 | Independent Director |
Hai Yan Liu | 60 | 2022 | Independent Director |
Zhi Hua Liu | 52 | 2019 | Financial Manager & Supervisor |
Vage Oganesian | 55 | - | Deputy GM & Director |
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