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Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing, etc.; and support services, such as mask design, design and maintenance of probe cards, thin film flip chip tape design, and test program development. Its packaging and testing products include various display driver chips, power management chips, RF front-end chips, etc. for applications in smart phones, tablets, laptops, high-definition TVs, smart wearables, and other fields. Hefei Chipmore Technology Co.,Ltd. was founded in 2004 and is based in Hefei, China.
| Name | Age | Since | Title |
|---|---|---|---|
| Qian Wu | 36 | 2024 | Supervisor |
| Ling Huang | 41 | 2024 | Director |
| Guoqing Yang | 44 | 2023 | Supervisor |
| Zongming Yang | 49 | - | GM & Director |
| Yeguang Cui | 68 | 2021 | Independent Director |
| Shiwei Luo | 60 | - | Director |
| Xiaolin Hu | 47 | 2021 | Independent Director |
| Chengqiang Yu | 55 | - | CFO, Deputy GM, Board Secretary & Director |
| Xin Wang | 59 | 2021 | Independent Director |
| Xiaobei Chen | 53 | 2023 | Chairman |
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