Darbond Technology Co., Ltd engages in the research and development, production, and sale of polymer engineering and interface materials in China. The company offers integrated circuit packaging, thermal conducting interface, high end equipment application, and new energy application materials products. It also offers solutions, including integrated circuit solutions panel display solutions, intelligent device and power battery solutions. The company also engages in the research and development, manufacturing, and sale of thermal conductive interface materials. Darbond Technology Co., Ltd was founded in 2003 and is headquartered in Yantai, China.
Metrics to compare | 688035 | Sector Sector - Average of metrics from a broad group of related Basic Materials sector companies | Relationship Relationship688035PeersSector | |
|---|---|---|---|---|
P/E Ratio | 70.6x | 58.0x | 1.8x | |
PEG Ratio | 1.98 | 0.37 | 0.00 | |
Price/Book | 3.3x | 2.3x | 1.6x | |
Price / LTM Sales | 5.1x | 3.2x | 1.4x | |
Upside (Analyst Target) | 6.4% | 1.2% | 16.0% | |
Fair Value Upside | Unlock | −4.1% | −2.2% | Unlock |