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TOWA Corporation engages in the design, development, manufacture, and sale of semiconductor manufacturing equipment and high-precision molds in Japan and internationally. It operates through three segments: Semiconductor Manufacturing Equipment, Medical Device, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment manufactures and sells precision molds for semiconductor manufacturing, molding equipment, singulation equipment, etc.; and provides after–sale services. The Medical Device segment manufactures and sells medical devices and other products. The Laser Processing Equipment segment is engaged in the manufacture and sale of laser processing equipment and provision of after–sale services. Its products also include precision molds, end mills and drill series, TEN-systems, and mold release films. The company was formerly known as TOWA Precision Industries Limited and changed its name to TOWA Corporation in December 1988. TOWA Corporation was incorporated in 1979 and is headquartered in Kyoto, Japan.
Metrics to compare | 6315 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship6315PeersSector | |
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P/E Ratio | 23.6x | 13.5x | 11.9x | |
PEG Ratio | −1.20 | 0.41 | 0.01 | |
Price/Book | 2.3x | 1.6x | 2.4x | |
Price / LTM Sales | 2.9x | 1.7x | 2.2x | |
Upside (Analyst Target) | 23.7% | 22.1% | 19.2% | |
Fair Value Upside | Unlock | 14.3% | 4.7% | Unlock |