Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. It provides wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. The company also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, it provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.
Metrics to compare | 3374 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship3374PeersSector | |
|---|---|---|---|---|
P/E Ratio | 36.5x | 50.7x | 12.2x | |
PEG Ratio | −1.71 | 0.87 | 0.01 | |
Price/Book | 5.1x | 3.1x | 2.4x | |
Price / LTM Sales | 6.8x | 3.6x | 2.3x | |
Upside (Analyst Target) | −13.6% | 0.2% | 21.5% | |
Fair Value Upside | Unlock | −1.8% | 3.3% | Unlock |