Siliconware Precision Industries (SPIL)

Siliconware Precision Industries Co., Ltd. provides semiconductor packaging, wafer bumping, wafer sort, assembly, and testing services in North America, China, Taiwan, Europe, and internationally. The company offers assembly services, such as substrate, lead frame, and bumping mask design services, as well as reliability test and failure analysis, and consultation services through design and package characterization centers. It provides testing solutions that include digital and mixed signal devices, as well as test engineering services; and post-test services, which comprise marking, lead/ball scan, baking, tape and reel, dry pack, and drop shipment. The company offers wafer bumping services, including printed bump, plated bump, and ball placement technology with eutectic, lead free, and copper pillar materials. It also provides lead frame and substrate base packages, such as ball grid array (BGA) package technology for microprocessors/controllers, DSPs, ASICs, gate arrays, memory, and PC chipsets; and chip scale packages for memory, microprocessors/controllers, analog, Flash, SRAM, DRAM, ASICs, DSPs, RF devices, and PLDs. In addition, the company offers stack die packages for wireless and portable products, and memory cards; multi-package BGA to repack ICs into a single package; and quad and dual packages for low pin count applications, as well as laptop PCs, communication devices, cordless/RF, memory, micro-controllers/processors, ASIC, DSP, gate arrays (FPGA/PLD), SRAMs, PC chipsets, telecom, disk drives, pagers, wireless, CATV/RF modules, and video/audio. Further, it provides SOP and QFP packages; wafer thinning, fine pitch wire and stacked-die bonding, and flip-chip assembly technologies. The company serves fabless design houses, integrated device manufacturers, and wafer foundries. The company was founded in 1984 and is headquartered in Taichung, Taiwan. Siliconware Precision Industries Co., Ltd. operates as a subsidiary of ASE Technology Holding Co., Ltd.